A PROVEN SOLUTION FOR OPTIMAL CONTROL OF YOUR REFLOW PROCESSES

THERMAL CONTROL FOR PROCESS FLEXIBILITY AND ADAPTABILITY

FAST MAINTENANCE FOR MAXIMUM AVAILABILITY

GRADUAL THERMAL TRANSITION ENSURING COMPONENT INTEGRITY

XRC reflow ovens use convection technology to deliver controlled and even heat distribution. This precision ensures high-quality soldering and reliable assembly of electronic components on the PCB. Designed to optimize your production, the system offers easy maintenance access and quick cleaning to minimize downtime. Robust and efficient, it meets the demanding standards of the electronics manufacturing industry.

XRC reflow oven dimensions

CONVECTION TECHNOLOGY

IPC CFX COMPATIBLE

  • Easy and accessible maintenance
  • Gradual and uniform thermal transition
  • Optimal soft soldering quality
  • Compliance with the most sensitive components
  • Optimized thermal insulation
  • Energy efficient
  • Operator risk management (EHS)

THE XRC REFLOW OVEN CAN BE SUPPLIED AS A STANDALONE UNIT OR AS PART OF A COMPLETE SOLUTION

Related equipment