XPC
DESIGNED FOR CURING THE MOST DEMANDING APPLICATIONS: UNDERFILL, GLOB TOP, SMA, DAM AND FILL, POTTING, TIM
THERMAL CONTROL FOR CONSISTENT AND RELIABLE CURING
COMPLIANCE WITH THE MOST SENSITIVE COMPONENTS
MODULARITY FOR A PROCESS TAILORED TO YOUR APPLICATION NEEDS
The XPC curing oven delivers uniform heat distribution through forced convection. It ensures deep, reliable curing even for the most demanding applications, such as underfill, glob top, SMA, dam and fill, potting, and TIM. Custom designed, it adapts to your specific needs to optimize throughput and ensure consistent production quality.
CONVECTION TECHNOLOGY
IPC CFX COMPATIBLE
- Custom design tailored to your process
- Up to 4 conveyor lanes
- Fast MES integration
- Easy and accessible maintenance
- Operator risk management (EHS)
THE XPC CURING OVEN CAN BE SUPPLIED AS A STANDALONE UNIT OR AS PART OF A COMPLETE SOLUTION
XPC curing oven integrated into a dispensing line
